PKG Engineer

2 개월전에


Bucheonsi, 대한민국 Onsemi 풀타임

The position is responsible for managing and operating Bucheon thermal characterization Lab
-. Thermal analyzer maintenance and improve the test method
-. Validate the test method for the thermal resistance of power modules.
-. Maintain equipment using Gauge RnR, Calibration, MSA(measurement system analysis)
-. Equipment capability enhancement - power cycles, new fixture design
-. Create and release reports of the test result to the requesters
-. Correlate the measurement result with the computed simulated result (eg. CFD, ICEPAK, Flotherm)
-. Quickly support the requested tasks within the determined cycle time

The position is responsible for managing and operating Bucheon thermal characterization Lab
-. Thermal analyzer maintenance and improve the test method
-. Validate the test method for the thermal resistance of power modules.
-. Maintain equipment using Gauge RnR, Calibration, MSA(measurement system analysis)
-. Equipment capability enhancement - power cycles, new fixture design
-. Create and release reports of the test result to the requesters
-. Correlate the measurement result with the computed simulated result (eg. CFD, ICEPAK, Flotherm)
-. Quickly support the requested tasks within the determined cycle time

'- Bachelor's degree in the relevant area.
least 5yrs or more experience in thermal resistance measurement of power modules
- Able to work in shift-oeration(Day or Evening) in urgent cases.
- Prefer with fluent English skill (writing, speaking)
- Lively character to harmonize with existing team members



  • Bucheon-si, 대한민국 Onsemi 풀타임

    •Work with a team of Industrial products applications engineers supporting BU objectives. •Define product (SiC, High Voltage MOSFETs, IGBT, Gate Drive IC, Rectifier, FRD, PKG also) requirement specification requirements for new products into communication with technical development engineering. •Validate Electrical performance evaluation through...


  • Bucheon-si, 대한민국 Onsemi 풀타임

    Discussion with development engineer for new development package design. (Package lay-out, Lead frame design, etc…) Discussion with vender for new development tool design. FOL: SMT process jig & tool design, Al & Au wire bonding clamp design, other jig design EOL: Mold chase design, Trim/Form module design, other jigs design POC (Proof of...